Folks,
Awhile back IPC was doing a strawman on via protection.  I have attached
the email.  Has this gone anywhere?

John Laur
Rockwell Automation
Milwaukee, WI

---------------------- Forwarded by John C Laur/Milwaukee/RA/Rockwell on 10/04/2004 08:41 AM ---------------------------
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Subject:        [DC] Design for Via Protection

Hello Designer Council Members,



IPC is in the process of building an industry user's guide for via
protection, including tent, fill, plug and capping technology.  The
D-33d Via Protection Task Group is looking for feedback from PCB
designers into the existing Via Protection Strawman, and how it can be
appended or edited to serve as an effective industry guideline
addressing design, material, and performance concerns for the protection
of vias.  This will be a stepping stone towards the eventual development
of design requirements for the IPC-2220 Design Standard Series and
acceptance criteria for the IPC-6010 Qualification and Performance
Series.



If you are interested in reviewing this draft and submitting comments to
the D-33d task group, please contact me directly at [log in to unmask]
This task group will meet at IPC Printed Circuits Expo/APEX 2004 the
week of February 23rd to review industry feedback.



Regards,



John Perry

Technical Project Manager

IPC

[log in to unmask]

1-847-790-5318 (P)

1-847-509-9798 (F)

Visit www.ipcprintedcircuitexpo.org for Tech session and standards

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