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Date: | Fri, 8 Oct 2004 11:55:24 -0400 |
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Hi Group,
Solder balls that are smaller than 0.13 mm (0.005 inch) and less than 5 per
600 mm squared (0.93 sq inch) are process indicators. If greater than 0.13
mm and not entrapped then it would be a defect. By entrap it usually means
solder balls are trapped in no clean flux or in adhesives of some sort or
tacked on to a conductor but not creating a clearance violation.
Joe Bruce
Functional Excellence
Solectron - Winnipeg
204 631-7233
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-----Original Message-----
From: Tom Moore [mailto:[log in to unmask]]
Sent: Friday, October 08, 2004 9:36 AM
To: [log in to unmask]
Subject: [TN] Solder balls acceptance criteria
Dear Group,
I'm asking the group again to impart your communal wisdom in interpreting
IPC-A-610. We are seeing solder balls on our SMT assemblies after they have
gone thru board wash (dishwasher). Would these be classified as
entrapped/encapsulated and therefore process indicators and not subject
to "rework" (as long as they don't violate minimum electrical clearance)?
Thanks.
Tom Moore
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