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Date: | Wed, 1 Sep 2004 09:21:00 +0300 |
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Of course, attachments are stripped on TechNet! Bill sent me a copy of
the file and this is what it said:
EXPERIMENTAL CONDITIONS FOR FILAMENT
FORMATION BY ELECTROMIGRATION
Board Fabrication: Panel plate, film resist, etch solder dip, liquid
leveling.
Prior Cleaning: Triclene
Separation: 0.04” or 1 mm.
Water Drop: Deionized water
Applied DC Voltage: 10 volts
Filament Formation: Cathode (-) to Anode (+)
Current: 40 microamps prior to filament bridge
300 microamps after bridge formation
1000 microamps as additional bridges form
Resistance: 3 x 1012 before water drop
3 x 1012 after evaporation of water drop
Room Conditions: 24º C, 15% relative humidity
Magnification: 15x
Time Compression: None, film is in real time
Reference: C. W. Jennings, IPC Technical Review, pp 9-16. (Feb., 1976)
[Film cited in Footnote 12]
This confirms what I cited from memory, even down to the 10 kilohm
current limiting resistor!
Thanks, Bill.
Brian
[log in to unmask] wrote:
> Checked my files, located the paper summarizing the Experimental Conditions
> for Filament Formation by Electromigration from Dr Jenning's film (see attached
> Word document).
>
> Bill Kenyon
> Global Centre Consulting
> 3336 Birmingham Drive
> Fort Collins, CO 80526
> Tel: 970.207.9586 New Cell: 970.980.6373
>
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