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September 2004

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brian Ellis <[log in to unmask]>
Date:
Wed, 1 Sep 2004 09:21:00 +0300
Content-Type:
text/plain
Parts/Attachments:
text/plain (65 lines)
Of course, attachments are stripped on TechNet! Bill sent me a copy of
the file and this is what it said:
EXPERIMENTAL CONDITIONS FOR FILAMENT
FORMATION BY ELECTROMIGRATION


Board Fabrication:              Panel plate, film resist, etch solder dip, liquid
leveling.
Prior Cleaning:         Triclene
Separation:                     0.04” or 1 mm.
Water Drop:                     Deionized water
Applied DC Voltage:             10 volts
Filament Formation:             Cathode (-) to Anode (+)
Current:                        40 microamps prior to filament bridge
                                300 microamps after bridge formation
                                1000 microamps as additional bridges form
Resistance:                     3 x 1012  before water drop
                                3 x 1012  after evaporation of water drop
Room Conditions:                24º C, 15% relative humidity
Magnification:          15x
Time Compression:               None, film is in real time
Reference:                      C. W. Jennings, IPC Technical Review, pp 9-16. (Feb., 1976)
   [Film cited in Footnote 12]

This confirms what I cited from memory, even down to the 10 kilohm
current limiting resistor!

Thanks, Bill.

Brian


[log in to unmask] wrote:
> Checked my files, located the paper summarizing the Experimental Conditions
> for Filament Formation by Electromigration from Dr Jenning's film (see attached
> Word document).
>
> Bill Kenyon
> Global Centre Consulting
> 3336 Birmingham Drive
> Fort Collins, CO   80526
> Tel: 970.207.9586   New Cell: 970.980.6373
>
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