I talked with our ME's here and they inform me that the current process of
using tin/lead solder WILL BE COMPATIBLE with the new 'lead free' parts that
are being manufactured... So why change processes if you don't need to deal
with the EU...?
The ME's say they have real issues with inspecting high temp solder joints
that do not wet or wick like tin/lead solders... I would expect more trouble
with the ductility of other alloys too, so if your surface mount board is
undergoing thermal excursions and getting stressed at the solder joints due
to CTE mismatches the other alloys are more likely to crack due to work
hardening... and less ductility.
How much real research has been done into these alternative alloys? Do you
want to ride in a Space Shuttle with lead free solder joints? Or put a pace
maker in your chest that has lead free solder joints? Are they truly
reliable?
Who's really driving the move to lead free?
I still maintain that leaded car batteries are a much greater threat to the
environment than cell phones with solder on the small parts they carry
inside. Look at how many cars there are that have to change their batteries
every 5 years or less...
Bill Brooks
PCB Design Engineer , C.I.D., C.I.I.
Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
http://pcbwizards.com
-----Original Message-----
From: Dehoyos, Ramon [mailto:[log in to unmask]]
Sent: Wednesday, September 08, 2004 11:13 AM
To: [log in to unmask]
Subject: Re: [TN] Lead free
Since Japan is almost 100% lead free, what have they chosen as their
best alloy? or Europe?
Just a thought.
Ramon
-----Original Message-----
From: David Bergman [mailto:[log in to unmask]]
Sent: Wednesday, September 08, 2004 1:28 PM
To: Dehoyos, Ramon
Subject: RE: [TN] Lead free
Hi Ramon,
It will be interesting to see what Technet response is to this. My
personal opinion is that the industry is narrowing on the SAC alloy
(Tin/Silver/Copper). I also believe that the SAC 305 (3% Silver 0.5 %
copper, balance tin) will be the leading alloy. There is a significant
amount of R&D work looking at lower temperature alloys including Bismuth
and Zinc, but none of these are mainstream options yet.
Dave
David W. Bergman, CAE
Vice President, Standards, Technology and International Relations
IPC
2215 Sanders Road #250
Northbrook, IL 60062-6135
Phone 847-790-5340 Fax 847-504-2340
Mobile 847-867-1388
email [log in to unmask] www.ipc.org
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telephone number will be 1-847-615-7100 and the new main fax number will
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Wednesday, September 08, 2004 12:15 PM
To: [log in to unmask]
Subject: [TN] Lead free
Technetters:
Last time I checked there were more than a dozen different types
of lead free solders. Has the industry chosen the best one? Or is it
still experimenting with different types?
Regards,
Ramon
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