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September 2004

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From:
Joyce Koo <[log in to unmask]>
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Date:
Thu, 9 Sep 2004 10:07:23 -0400
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Ramon,
It is designer's/design team's duty to define the product, manufaturing and
storage conditions, select the material/process accordingly.  e.g. for one
of our device, the operating temperature is defined as 0 to +70C, MFG limit
is +25 to 240 C (limited at 240 C for 120 sec max), storage condition -40 to
+85 C... and goes with moisture sensitivity classification, etc.etc.  It
would be leadfree because it is allowed in the design (molding material,
interconnect material=solder, etc.etc.)... If someone did his/her job
correctly, OEM should not worry about it at all (it is a whole package
issue).  You should have different material for different classification of
the product(or use high class of material for all your products... a bit
pricy on the list, but pay the bill when you do bulk buying and easy to
manager).  I wouldn't use that same set of materials for device operate
like -55 to 125 C...It is all driven by the operating condition and
requirements of MFG, including solders (which "sensitive equipment" you are
building without solder material track record?  If you are a designer, you
will get a lot of trouble for not knowing the details... I can see the
lawyers smelling the blood here)...

Being said that, recently the OEM did a lot of material selection FOR the
designer, (we just use what ever you have "in house") either because the
"designer" didn't know better, or the manager want it "cheap" (rather than
order your own...).  For building a toy, that is sure a good money saving
way... as for the others, you have to assess the risk accordingly (remember,
most of the manager only stay on long enough to collect the outstanding
performance reward and move on... including some of CEOs...)

-1.53 cents
                             jk
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Dehoyos, Ramon
Sent: Thursday, September 09, 2004 9:31 AM
To: [log in to unmask]
Subject: Re: [TN] Lead free


        Hi Joe:
        The question is, isn't there enough variables as it is now to deal
with? What it is described below is research and development. We have to
build product that may go in very sensitive pieces of equipment. Some will
have to use solders with no track record and expose boards and parts to much
hotter environment for reflow.
        Regards,
        Ramon

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Precision Analytical
Lab
Sent: Wednesday, September 08, 2004 5:32 PM
To: [log in to unmask]
Subject: Re: [TN] Lead free


Ken,

Certainly I agree with your comments.  The lead-free challenge is maybe a
bit more difficult then past transitions.  But it is still up to you (the
manufacturer) to find the materials that will work best for your product.
Doug Pauls always tells me and I quote "It depends" when I have asked
questions of him with respect to these issues.  His answer (while seemingly
to avoid) makes alot of sense.  You have to define for your product what
alloys, what laminates, what fluxes, what materials etc. are going to work
best based on the end use environment.  Not everyone in manufacturing is
privy to your process environment or product/s or for that matter their end
use environment.  Those people who have answered you the way I did are
trying to be helpful in a cautious way.  If I or anyone else were to tell
you to use a SAC alloy of  Sn96.5Ag3.0Cu0.5 and it not work with your
product or
manufacturing style; who ends up with egg on their face?  My role as an
independant analysts is t!
o help
 you find the solutions that will work, not to pull them out of the air.
The question of where to begin requires some thought on your part.
Unfortunately there are no cookie cutter answers and I would be cautious of
those who try pass off as though there are.

Best Regards

Joe Russeau
Precision Analaytical Laboratory
"Bloomquist, Ken" <[log in to unmask]> wrote:
Hi Joe,

I don't know how many times I've been given the same answer that you gave. I
think what people are asking is what it the optimal place to start given a
particular industry.

While there are a ton if different leaded alloys the industry pretty much
standardized on 63/37. Sure there were a few exceptions but in general if
you were getting started that was the best place to start.

What probably every small and even some large companies are asking is "where
do we start to achieve the greatest degree of success". Everyone still has
to qualify their process but at least if they were given an average board
type, flux type, solder type, paste type, etc. that has a little track
record, it sure would help.

My 2C worth,

KennyB
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Precision Analytical
Lab
Sent: Wednesday, September 08, 2004 2:56 PM
To: [log in to unmask]
Subject: Re: [TN] Lead free


Mustafa,

While many may be willing to share what lead-free materials have worked well
for their manufacturing environment, it is still up to you or whoever makes
those desicions in your organization to find ones that will work for your
process. It has been stated many times that qualifying to lead-free is the
same as any other process qualification. You have to start at the bottom and
work your way up. Unfortunately for everyone, alot of research time and work
has to go into transitioning a process from one material to another. To
answer your question about which material, try talking with Kester or Alpha
Metals. Both have good reputations and their materials can be found in
numerous manufacturing operations.

As far as alternatives to lead-free, the answer is unfortunatley no. The
choice is lead or no lead. If your company plans on selling product to
Europe, then it is required that the materials used within circuit board
manufacturing not contain any lead by July of 2006.

It sounds like you have alot of work ahead. I hope all goes well. If you
need further assistance, contact us offline.

Regards

Joe Russeau
Precision Analytical Laboratory

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