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September 2004

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Subject:
From:
"Kane, Joseph E (US SSA)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kane, Joseph E (US SSA)
Date:
Wed, 1 Sep 2004 10:26:19 -0400
Content-Type:
text/plain
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text/plain (49 lines)
I don't know of any standard for voiding in PTH joints,
and that is a good thing.

If you begin sectioning PTH joints, or any solder 
connections, you will see that voids happen, and like me, 
you may be very surprised how much and how often.

But we've fielded millions of through-hole connections
on aircraft and spacecraft, under severe vibration and thermal 
cycling, and no solder joint ever failed because of a void.

-Joe



-----Original Message-----
From: Victor G. Hernandez [mailto:[log in to unmask]]
Sent: Wednesday, September 01, 2004 9:25 AM
To: [log in to unmask]
Subject: [TN] Leaded PTH Voiding


Fellow TechNetters:

   Does anyone know of an IPC guideline/Standard that covers Leaded PTH
solder fillet voiding during a cross section evaluation.

Victor,

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