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September 2004

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brian Ellis <[log in to unmask]>
Date:
Wed, 1 Sep 2004 15:31:38 +0300
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Ingemar

I'm no expert here but, if the substrate permits the Ni to adhere
perfectly, then I see no problem. OTOH, you will require plenty of Cl-
ions to solder that darn nickel. It's probably a good thing that the Ni
is matte, because it shows there is not a massive co-deposit of organic
brighteners, which can cause dewetting. :-)

Brian

Ingemar Hernefjord (KC/EMW) wrote:

> Brian in topform,
>  maybe one can slip in another finish question in parallel? Imagine packages made of Al/Si 58/42. They are ISO-1458 electrolytic sulphamate nickel plated (at least what we ask for). There is no P but lots of Cl, and the appearance of the finish is greyish and extremly matte, much like old cadmium plate. And extremly sensitive to fingerprints. The nickel plate ought to be solderable (filter feedtrues, SMA etc). Question: does the high silicon content have any impact on the final nickel plating?
>
> Ingemar Hernefjord
> Ericsson Microwave Systems
>
>
>
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