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September 2004

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Subject:
From:
Ernie Fung <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ernie Fung <[log in to unmask]>
Date:
Wed, 8 Sep 2004 03:00:53 -0500
Content-Type:
text/plain
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text/plain (25 lines)
All,

Some questions about multi layer ceramics capacitor (MLCC):
1. Any specification for temperature ramp rate, that is the rate of temp
raise or reduce, of MLCC?
2. When mechanical stress is applied to the MLCC, fine crack may induce.
However, this may not be checked thru visual inspection or capacitance
change. So, is it a good idea to use thermal shock to enlarge this kind of
fine crack so that the failure is detectable?

Thanks for any suggestion.

Rgds,
Ernie

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