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September 2004

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Wed, 1 Sep 2004 08:17:14 -0400
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The Shadow Coating can have some issues with surface topography - we
have seen that as the batch ages the deposit thickness begins to vary
and the natural tooth of the shadow also is affected.  I believe this
time we increased our system cleaning schedule (FSL Conveyorized) to
ensure buildup in sumps and rollers was minimized and also increased the
dump schedule of the bath.



Jeffrey Bush
Director, Quality Assurance and Technical Support

                          76 Technology Drive - POB 1890
                             Brattleboro, Vermont 05302-1890
                                Tel. 802.257.4571.21 Fax. 802.257.0011
                                    [log in to unmask]
                              http://www.vtcircuits.com	



-----Original Message-----
From: Mike Wolf [mailto:[log in to unmask]] 
Sent: Tuesday, August 31, 2004 2:41 PM
To: [log in to unmask]
Subject: [TN] Resist adhesion failures


We are experiencing resist adhesion failures in a random spotty nature,
after develop traces and or pads will just not be adhered.

We run a cert. piece everyday that never has these problems. The cert
piece is ED/double treat right out of the box.

The copper that has the adhesion problems has been processed in our
shop, we run electrochem's shadow system.

I know its not much to go on more details available to anyone
interested.

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