I apologise to the forum for inadvertently copying to it, what was supposed
to be an off-line response in answer to a previous thread.  I can only plead
incompetence based on the certainty that I pressed 'reply' and not 'reply to
all'.

David Bernard

Dr. David Bernard
Product Manager X-ray Systems
Dage Precision Industries
Rabans Lane
Aylesbury
Buckinghamshire
HP19 8RG
United Kingdom

Tel: +44 (0) 1296 317800
Fax: +44 (0) 1296 435408

E-mail: [log in to unmask]
www.dage-group.com

> -----Original Message-----
> From: Crain, Peter (GE Energy) [SMTP:[log in to unmask]]
> Sent: Wednesday, September 22, 2004 5:06 PM
> Subject:      More simple BGA questions
>
> First: Thanks to everyone who gave feedback on my oven question......very
> helpful!!
>
> More BGA questions: Do BGAs require any special treatment when designing
> PCBs? Can there be top layer traces, vias, and components near the BGA? Is
> there a good general spacing around them to allow for inspection / repair?
> Can BGAs be mixed with through-hole and sustain the Wave Solder process
> (top-side of course) without the use of solder pallets?
>
> Thanks again in advance,
>
> Peter Crain, C.E.T
> Manufacturing Engineering
>
> > Network Reliability Services
> > General Electric Canada Inc.
> > 2728 Hopewell Place N.E., Calgary, Alberta T1Y 7J7  CANADA
> > Tel: 403.214.4560, Dialcomm: 8.498.4560 Fax: 403.214.4776
> > Email: [log in to unmask]
> > Website:  www.gepower.com/substationautomation
> >
> > NOTICE: The information contained in this e-mail is privileged,
> > confidential and intended solely for the use of the addressee named
> above.
> > If the reader of this e-mail is not the intended recipient, you are
> hereby
> > notified that any dissemination, distribution or copying of this e-mail
> is
> > strictly prohibited. If you have received this e-mail in error, please
> > notify me immediately by telephone (collect) at (1) 403.214.4400 and
> > destroy this e-mail as well as any copy. Thank you.
> >
> >
> >
> >
>
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