Hi all,
thanks for offline advice, have now many red threads, will tell all in the end what caused bond problem. Targets e.g.
* LPD (Light Point Defects)
* Plasma Cleaner re-deposition contaminations
* capillary tip epoxy residues
* thickfilm delaminations
* micro hardness variations
* cleaning agent residues
* pad metallisation process salts imbedded
* too thin pad metallisation
* distance to Kovar frame or cavities can affect mechanical wave response
mental strengtheners e.g.
* hangglider tour frees mind, better thinking (XX )
At the moment, we go for Plasma Cleaner something...logic choice.
Thanks again
Ingemar
Good Morning or Afternoon,
saw movie about the Amtrak incident on Mobile bridge. Terrible. So many unusual failures were involved to cause that accident. The detective work to reconstruct was impressive, they found the sources. Now, need detective work on micro problem, which can also make grey hair. Ordinary aluminium pads, Silicon chip, Autobonded, 25um Au wire, ball, chips silver epoxied, workpiece +150 Centigrades.
One side of chip have normal bonds, other side get oftenly bad bondings with following symptoms: aluminium metallisation bubbles and ball doesn't fasten, the bond pad get what looks like chipouts, but without classic look. Have checked everything: autobonder program, ceramic capillary, chip epoxy bond line, looked after bond pad contaminations, MCM fixture, ball formation, wire quality and a lot more...without finding the reason. Aluminium looks like it has been boiling, but how on earth could it, the machine just adds U/S power.
Maybe Phil, jk or other microguru can whet the neurons and propose some idea? Will post two photos to Steve's headache gallery, one with normal chip before bonding, the other after bonding.
In advance thanks giving I am (Yoda)
Ingemar Hernefjord
Ericsson Microwave Systems
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