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September 2004

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Subject:
From:
Kathy Kuhlow <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kathy Kuhlow <[log in to unmask]>
Date:
Wed, 22 Sep 2004 11:11:02 -0500
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For the wave soldering question, via thermal transfer can be minimized by a solder pallet or kapton tape over the vias on the solder side.  

>>> [log in to unmask] 09/22/04 11:05AM >>>
First: Thanks to everyone who gave feedback on my oven question......very
helpful!!

More BGA questions: Do BGAs require any special treatment when designing
PCBs? Can there be top layer traces, vias, and components near the BGA? Is
there a good general spacing around them to allow for inspection / repair?
Can BGAs be mixed with through-hole and sustain the Wave Solder process
(top-side of course) without the use of solder pallets?

Thanks again in advance,

Peter Crain, C.E.T
Manufacturing Engineering

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