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September 2004

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Subject:
From:
"Ingemar Hernefjord (KC/EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ingemar Hernefjord (KC/EMW)
Date:
Wed, 22 Sep 2004 10:33:57 +0200
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Hi Steve,

Homestead seems little abscentminded nowadays, I've sent pics, hope they'll show up soon. Capillary contamination, not likely, studied needles in SEM, they were clean and nice. Yes, there is one other chip too..listen, crazy..: the MCM is very large LTCC, heavy like an iron. In one end a chip is correctly bonded, in the opposite end the (SAME kind of chip) pads become 'burnt'. Will send pics to you, Steve. K&S, Palomar, manual, auto...same spoky phenomenon. Yes, am sober, and operators don't use chewing tobacco..no, not Friday 13 and there were no earthquakes at the time.

hard to confess I can't find out this...
Ingemar



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Creswick, Steven
Sent: den 21 september 2004 19:10
To: [log in to unmask]
Subject: Re: [TN] Strange wirebonding problem


Ingemar,

I am sure this was included in you examination for bond pad contamination, but just in case ....

The die pick up tool is not depositing residues on the chip from a previous mis-pick is it?

Just one side of a specific device and no other chips on the module?

Any opportunity to change device lots and try again?

Did not see a pic on Steve's site yet.

Steve Creswick - Gentex


-----Original Message-----
From: Ingemar Hernefjord (KC/EMW)
[mailto:[log in to unmask]]
Sent: Monday, September 20, 2004 5:54 AM
To: [log in to unmask]
Subject: [TN] Strange wirebonding problem


Good Morning or Afternoon,

saw movie about the Amtrak incident on Mobile bridge. Terrible. So many unusual failures were involved to cause that accident. The detective work to reconstruct was impressive, they found the sources. Now, need detective work on micro problem, which can also make grey hair. Ordinary aluminium pads, Silicon chip, Autobonded, 25um Au wire, ball, chips silver epoxied, workpiece +150 Centigrades.
One side of chip have normal bonds, other side get oftenly bad bondings with following symptoms: aluminium metallisation bubbles and ball doesn't fasten, the bond pad get what looks like chipouts, but without classic look. Have checked everything: autobonder program, ceramic capillary, chip epoxy bond line, looked after bond pad contaminations, MCM fixture, ball formation, wire quality and a lot more...without finding the reason.  Aluminium looks like it has been boiling, but how on earth could it, the machine just adds U/S power.

Maybe Phil, jk  or other microguru can whet the neurons and propose some idea? Will post two photos to Steve's headache gallery, one with normal chip before bonding, the other after bonding.

In advance thanks giving I am (Yoda)

Ingemar Hernefjord
Ericsson Microwave Systems

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