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September 2004

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Subject:
From:
Vu Dinh Tang <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Vu Dinh Tang <[log in to unmask]>
Date:
Wed, 22 Sep 2004 08:50:47 +0700
Content-Type:
text/plain
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text/plain (72 lines)
Peter,

We are using 4 zones reflow oven to solder our products, some of our
products having 02 BGA (15x15mm~27x27mm) but profile sill satisfied
specification (delta T <= 10 degree C). Measurement points are put at center
and corner of bga.
For your matter, my experience is:
1. Reflow oven: you can set conveyor speed at 60~65 cm/min., fan frequency
is 30~38 Hz.
2. PCBA: If your PCBA is single side component, you can use pallet to
support under PCB with through hole at BGA bumps and some low temperature
positions.

Hope this helps,

Vu Dinh Tang
 *********************************************************
 Fujitsu Computer Products of Viet nam (FCV)
 PCBA - Manufacturing Department
 PCBA - Engineering section
 E-mail: [log in to unmask]
 Adress: 31, 3A street, Bien Hoa Industrial Zone II, Dong Nai Province
Tel: 84  - 061- 836563 ~ 6 (Ext: 214) / Coin: 79691-214
 Fax: 84 - 061- 836561 ~ 2 / Coin: 79691-109/ 209
 *********************************************************

----- Original Message -----
From: "Crain, Peter (GE Energy)" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, September 21, 2004 4:06 AM
Subject: [TN] New reflow oven needed for BGAs???


> Hi all,
>
> We are looking at placing BGAs. We currently use a 5 zone reflow oven that
> does a great job of soldering all other components. In fact, we only have
a
> few profiles which are used on many products.
>
> Is there a need for more zones when going to BGA? Does size BGA size
matter?
>
> Thanks in advance,
>
> Peter
>
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