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September 2004

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Subject:
From:
Shean Dalton <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Shean Dalton <[log in to unmask]>
Date:
Tue, 21 Sep 2004 12:13:06 -0500
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Hello Peter,

A safe way to make this determination is to define the slowest conveyor
speed, the required profile, the largest BGA, and, the acceptable
temperature delta across that BGA.  Then, drill a hole thru the backside
of the board under the center of the BGA.  Mount a thermocouple here on
the BGA's center most pad, and, mount another thermocouple in a corner
BGA pad.  Next profile the board/BGA.  Compare what you get with what
you expect.  From there, you can make a determination if a five zone is
acceptable, or possibly acceptable.

In my experience, 5 reflow zones do give enough profile definition and
can be acceptable if the conveyor speeds meet required line speeds.
Note: Cooling (the downward side of TAL) warrants as much attention as
heating.

Hope this helps,

Shean Dalton
Austin American Technology
www.aat-corp.com <http://www.aat-corp.com>

-----Original Message-----
From: Crain, Peter (GE Energy)
Sent: 9/21/2004 11:43 AM
To: [log in to unmask]
Subject: [TN] New reflow oven needed for BGAs???


Hi all,

We are looking at placing BGAs. We currently use a 5 zone reflow oven
that
does a great job of soldering all other components. In fact, we only
have a
few profiles which are used on many products.

Is there a need for more zones when going to BGA? Does size BGA size
matter?

Thanks in advance,

Peter

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