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September 2004

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From:
- Bogert <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, - Bogert <[log in to unmask]>
Date:
Wed, 15 Sep 2004 18:38:55 -0400
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September 15, 2004

See my previous e-mail response on this topic.
  ----- Original Message ----- 
  From: Susan Mansilla<mailto:[log in to unmask]> 
  To: [log in to unmask]<mailto:[log in to unmask]> 
  Sent: Monday, September 13, 2004 5:41 PM
  Subject: Re: [TN] (2)PWB Conductive Contamination Under Solder Mask; What Can ...


  OK, just so we all understand what is going on with your boards

  You reported that the contamination showed to be of Tin and Lead and Copper
  composition.
  I think we all believed that the boards are Solder Mask Over Bare Copper.

  Scotch brite and other abrasive brushing systems to enhance solder mask
  adhesion are used AFTER the Tin/Lead etch resist has been removed - therefore
  debris left from this process should be only copper in composition.

  If you are using such a process while the Tin/Lead is still on the board -
  there is a definite possibility that the slivers are a result of the brushing
  operation no matter whether or not there was an overplated situation.

  If you are using such a process after the Tin/Lead has been removed and are
  still getting Tin and Lead in the slivers then 1)  the tin/lead strip is not
  adequate and/or 2)  the brushes or scotch brite material is contaminated from
  some other source and are depositing the slivers on the board.

  Please let us know when and how the scotch brite is being used - that would
  help in the discussions.

  Susan Mansilla
  Robisan Lab

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