Hi Bryan:
Have you tried swaging them a little loose, before soldering them? Just a thought.
Regards,
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kerr, Bryan
Sent: Wednesday, September 15, 2004 11:27 AM
To: [log in to unmask]
Subject: Re: [TN] HMP Solder Joint Cracking
The cracks occur immediately on alloy solidification - I've watched it
happen under a scope. Can't be sure that some don't occur later but that is
a worrying thought which could affect reliability.
Cheers
Bryan
-----Original Message-----
From: Marsico, James [mailto:[log in to unmask]]
Sent: 15 September 2004 16:21
To: 'Kerr, Bryan'
Subject: RE: [TN] HMP Solder Joint Cracking
When are the cracks occurring? Ate the assemblies thermally stressed after
the terminals are soldered? Do the cracks occur after a wire is soldered to
the turrets?
Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879
-----Original Message-----
From: Kerr, Bryan [SMTP:[log in to unmask]]
Sent: Wednesday, September 15, 2004 11:07 AM
To: 'Marsico, James'; IPC Mailing List (E-mail)
Subject: RE: [TN] HMP Solder Joint Cracking
Thanks Jim
We are seeing some of the edge solderability issues that you mention
however
there is definite cracking as shown in microsections done by
ourselves.
Another batch of pins has better solderability at the edge however
we still
get cracks occurring.
Cheers
Bryan
-----Original Message-----
From: Marsico, James [mailto:[log in to unmask]]
Sent: 15 September 2004 16:04
To: 'TechNet E-Mail Forum'; 'Kerr, Bryan'
Subject: RE: [TN] HMP Solder Joint Cracking
*** WARNING ***
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Keep this in mind if you answer this message.
We've seen this problem in the past. The main culprit, in our case,
was the
solderability of the terminal on the corner of the swaged area.
What looks
like a crack may be an unsolderable line around the periphery of the
swaged
area. Try dipping the swaged end of a terminal into a solder pot
and see if
the corner edge wets.
Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879
-----Original Message-----
From: Kerr, Bryan [SMTP:[log in to unmask]]
Sent: Wednesday, September 15, 2004 10:35 AM
To: [log in to unmask]
Subject: [TN] HMP Solder Joint Cracking
Hi
We are fitting a swaged turret terminal and soldering using
96% Tin
4%
Silver alloy and have experienced cracks running around the
edge of
the
swage solder joint - between the pin and the solder.
Re-soldering
gets rid
of it in most but not all cases. I have thought that perhaps
some
stress
relaxation is occurring in the swage area (brass base
material)
during
soldering resulting in these cracks.
Can anyone shed any light on this problem ?
Cheers
Bryan Kerr
Principal Quality Engineer
Process and Materials Laboratory
AMS Hillend
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