Thanks Jim

We are seeing some of the edge solderability issues that you mention however
there is definite cracking as shown in microsections done by ourselves.
Another batch of pins has better solderability at the edge however we still
get cracks occurring.

Cheers

Bryan

-----Original Message-----
From: Marsico, James [mailto:[log in to unmask]]
Sent: 15 September 2004 16:04
To: 'TechNet E-Mail Forum'; 'Kerr, Bryan'
Subject: RE: [TN] HMP Solder Joint Cracking


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We've seen this problem in the past.  The main culprit, in our case, was the
solderability of the terminal on the corner of the swaged area.  What looks
like a crack may be an unsolderable line around the periphery of the swaged
area.  Try dipping the swaged end of a terminal into a solder pot and see if
the corner edge wets.

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879



        -----Original Message-----
        From:   Kerr, Bryan [SMTP:[log in to unmask]]
        Sent:   Wednesday, September 15, 2004 10:35 AM
        To:     [log in to unmask]
        Subject:        [TN] HMP Solder Joint Cracking

        Hi

        We are fitting a swaged turret terminal and soldering using 96% Tin
4%
        Silver alloy and have experienced cracks running around the edge of
the
        swage solder joint - between the pin and the solder. Re-soldering
gets rid
        of it in most but not all cases. I have thought that perhaps some
stress
        relaxation is occurring in the swage area (brass base material)
during
        soldering resulting in these cracks.
        Can anyone shed any light on this problem ?

        Cheers

        Bryan Kerr
        Principal Quality Engineer
        Process and Materials Laboratory
        AMS Hillend


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