In response to KennyB these cracks are in the solder joint not in the swaged
pin. I also think to anneal brass you are talking about temperatures in the
region of 400 C which is way beyond that which the PEC can withstand.
Intersting to see that others are experiencing similar problems. I have also
noticed that we have no cracks in the swaged pin - perhaps slits during
swage would help by reducing the residual stress in the swage area - an
argument for having swage splits - surely not !

Bryan

-----Original Message-----
From: Bloomquist, Ken [mailto:[log in to unmask]]
Sent: 15 September 2004 15:49
To: [log in to unmask]
Subject: Re: [TN] HMP Solder Joint Cracking


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We've found that annealing helps reduce cracking a whole lot. I've never
seen a standoff crack during the soldering operation, only during swaging.
Are you sure they are cracking during the soldering?

KennyB

-----Original Message-----
From: Kerr, Bryan [mailto:[log in to unmask]]

Sent: Wednesday, September 15, 2004 9:35 AM
To: [log in to unmask]
Subject: [TN] HMP Solder Joint Cracking

Hi

We are fitting a swaged turret terminal and soldering using 96% Tin 4%
Silver alloy and have experienced cracks running around the edge of the
swage solder joint - between the pin and the solder. Re-soldering gets rid
of it in most but not all cases. I have thought that perhaps some stress
relaxation is occurring in the swage area (brass base material) during
soldering resulting in these cracks.
Can anyone shed any light on this problem ?

Cheers

Bryan Kerr
Principal Quality Engineer
Process and Materials Laboratory
AMS Hillend

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