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September 2004

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Subject:
From:
Charles Caswell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Charles Caswell <[log in to unmask]>
Date:
Wed, 15 Sep 2004 09:59:18 -0500
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text/plain (86 lines)
I can agree to this. I suggested covering both sides just because most of our
customers question uncovered via's. Not sure why, especially those with
specific notes on drawing to leave via's unplugged and not masked.

-----Original Message-----
From: Jeffrey Bush [mailto:[log in to unmask]] 
Sent: Wednesday, September 15, 2004 7:56 AM
To: [log in to unmask]
Subject: Re: [TN] Question about via masking on BGA pattern...

I would recommmend the opposite of this - plug from the BGA side and
leave the bottom open for testing.



Jeffrey Bush
Director, Quality Assurance and Technical Support

                          76 Technology Drive - POB 1890
                             Brattleboro, Vermont 05302-1890
                                Tel. 802.257.4571.21 Fax. 802.257.0011
                                    [log in to unmask]
                              http://www.vtcircuits.com	



-----Original Message-----
From: Steve Gregory [mailto:[log in to unmask]] 
Sent: Wednesday, September 15, 2004 8:44 AM
To: [log in to unmask]
Subject: [TN] Question about via masking on BGA pattern...


Mornin' All!

I have a question about solder masking via's in a BGA pattern, and want
to see if I'm thinking correctly about this.

I think it's a bad idea to leave the via's free from solder mask on the
topside of the board beneath the BGA, and tent the bottomside via's. To
me, you're just asking for trouble down the road because you'll trap
flux residue and all kinds of stuff in the via's that won't be able to
be cleaned out well. This is a 676 ball 1.0mm pitch BGA pattern. Am I
wrong about this?

Thanks!

-Steve Gregory-

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