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September 2004

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Subject:
From:
"Bloomquist, Ken" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bloomquist, Ken
Date:
Wed, 15 Sep 2004 07:49:26 -0700
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We've found that annealing helps reduce cracking a whole lot. I've never seen a standoff crack during the soldering operation, only during swaging. Are you sure they are cracking during the soldering?

KennyB

-----Original Message-----
From: Kerr, Bryan [mailto:[log in to unmask]] 
Sent: Wednesday, September 15, 2004 9:35 AM
To: [log in to unmask]
Subject: [TN] HMP Solder Joint Cracking

Hi

We are fitting a swaged turret terminal and soldering using 96% Tin 4%
Silver alloy and have experienced cracks running around the edge of the
swage solder joint - between the pin and the solder. Re-soldering gets rid
of it in most but not all cases. I have thought that perhaps some stress
relaxation is occurring in the swage area (brass base material) during
soldering resulting in these cracks.
Can anyone shed any light on this problem ?

Cheers

Bryan Kerr
Principal Quality Engineer
Process and Materials Laboratory
AMS Hillend

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