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September 2004

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Subject:
Re: TechNet Digest - 13 Sep 2004 to 14 Sep 2004 (#2004-243)
From:
Bob K Veale <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bob K Veale <[log in to unmask]>
Date:
Wed, 15 Sep 2004 09:05:00 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (20 lines) 
RE: Lead free soldered products in S- containing atmosphere.
The area of concern in sulfur environments is the surface finish of the
PCB.  ENIG and immersion silver finishes do not perform well in
environments with airborne sulfur.  Creep corrosion can create resistive
shorts between adjacent circuit nodes.

Bob Veale
Rockwell Automation
Mayfield Hts. Ohio

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