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September 2004

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Subject:
From:
Dave Simonik <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 15 Sep 2004 07:42:19 -0400
Content-Type:
text/plain
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text/plain (62 lines)
Yes, by using a Co2 laser at low power settings. Most, if not all maskings
can be removed from pads and traces with a laser. The mask will be ablated
very easily, and will not harm the metal of the circuitry, as long as very
low power / pulses are used. After laser ablation, process your boards
(unpopulated) through a final clean / acid rinse to remove any remaining
debris. Any small soldermask touchups can be re-applied by hand. If the
laser process (Program & parameters) is setup correctly, you may not need
any touchup at all. Major touchup could be reapplied using a new 'Rework'
artwork / screening / LPI process.  Not sure of any chemicals that can be
used.

Dave Simonik
Sanmina-SCI
Owego NY Division


-----Original Message-----
From: - Bogert [mailto:[log in to unmask]]
Sent: Wednesday, September 15, 2004 5:45 AM
To: [log in to unmask]
Subject: LPI Solder Mask on Class 3 Product; Can it be removed?


September 15, 2004

Does anyone know of a method to remove fully cured LPI solder mask
(IPC-SM-840, Class 3 product) from an FR-4 PWB without damaging the PWB or
otherwise creating possible condition for growing dendrites?

If chemicals can be used, are they non-conductive?

If solder mask needs to be touched up because of missing solder mask,
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-----------------------------------------------------
how do folks do this?

____________________________________________________________________________
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Scanned by Sanmina-SCI eShield
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