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September 2004

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From:
- Bogert <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, - Bogert <[log in to unmask]>
Date:
Wed, 15 Sep 2004 05:38:32 -0400
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September 15, 2004

Thanks for the information and history lesson.  What happens in the world when all of us old folks are no longer here?

PS can you give me details on your book and where to purchase it?  Thanks
  ----- Original Message ----- 
  From: Brian Ellis<mailto:[log in to unmask]> 
  To: [log in to unmask]<mailto:[log in to unmask]> 
  Sent: Tuesday, September 14, 2004 1:55 AM
  Subject: Re: [TN] (2)PWB Conductive Contamination Under Solder Mask; What Can ...


  You must be aware that using abrasive brushing (Scotchbrite (R) or
  slurry) is a major cause of solder dewetting. Micro-particles of
  abrasive get implanted in the metal, which is even swaged over some of
  them. I have PROVED this time and time again. I published this in a
  paper 'New Aspects on the Solderability of Printed Circuits' in the
  Technical Proceedings of Inter/Nepcon '69, in Brighton, as well as in my
  book (pp. 76 ff). It is amazing that a problem that was identified 35
  years ago is still largely ignored! :-(

  Brian

  Susan Mansilla wrote:
  > Hi Mike and All
  > I am familiar with the abrasive wheel cleaning processes. but those are done
  > AFTER the tin/lead has been stripped.  The response I got indicated that the
  > abrasive was used on the Tin/Lead deposit, which didn't follow my idea of a
  > possible process flow.
  > Some PCB fab shops continue to use a "Scotch Brite" style of
  > abrasive wheel or brush as a final surface prep operation prior to
  > soldermask application.
  > Susan Mansilla
  > Robisan Lab
  >
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