TECHNET Archives

September 2004

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Wei-Shun Wang <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wei-Shun Wang <[log in to unmask]>
Date:
Mon, 13 Sep 2004 15:38:05 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (22 lines)
Hi,

Is there a good method to hand solder 0402 cap to hard gold plated pads (30-50 micro inches) and maintain reliability?
It is a design issue. Customer needs to install a BGA socket on top side. So they specify hard gold plate on BGA area.
But there are lots of caps on bottom side of the BGA and those pads are plated with hard gold too. No one wants to
scrap those fabs due to hot schedule and high cost. Please advise.

Thanks,
Wei Wang
Process Engineer
Sanmina-SCI

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2