OK, just so we all understand what is going on with your boards

You reported that the contamination showed to be of Tin and Lead and Copper
composition.
I think we all believed that the boards are Solder Mask Over Bare Copper.

Scotch brite and other abrasive brushing systems to enhance solder mask
adhesion are used AFTER the Tin/Lead etch resist has been removed - therefore
debris left from this process should be only copper in composition.

If you are using such a process while the Tin/Lead is still on the board -
there is a definite possibility that the slivers are a result of the brushing
operation no matter whether or not there was an overplated situation.

If you are using such a process after the Tin/Lead has been removed and are
still getting Tin and Lead in the slivers then 1)  the tin/lead strip is not
adequate and/or 2)  the brushes or scotch brite material is contaminated from
some other source and are depositing the slivers on the board.

Please let us know when and how the scotch brite is being used - that would
help in the discussions.

Susan Mansilla
Robisan Lab

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