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September 2004

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Subject:
From:
Phil Hinton <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 13 Sep 2004 10:59:13 EDT
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3-8 micro inches is quite manageable for electrolytic gold plate over
electroytic nickel on pads that have to be soldered.  A even beter variation of this
is to put 3-8 microinches of
electrolytic palladium between the gold and nickel.  The palladium greatly
improves solderability if the board is subject to long storage, heat sink
bonding operations at higher temperatures  or high humnidty atmosphere during
storage or assemble prep.  This process is used frequently for boards that must
experience near 200 dg, C. operation temperatures.  It is desireable to keep the
palladium  thickness below 20 microinches as it subject to solder joint
embrittlement similar to the problem with gold when the gold is over 10 micrincbes
thick.

Phil Hiinton
Hinton PWB Engineering   .

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