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September 2004

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Subject:
From:
paul reid <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, paul reid <[log in to unmask]>
Date:
Mon, 13 Sep 2004 10:29:57 -0400
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Ref: Conductive Contamination Under S/M - Cause

I have seen this phenomenon many times.  It is copper slivers from the edge
of the traces breaking off as long metal threads and being captured under
the solder mask.  In the process of copper etching, after pattern plating,
the enchant will etch down and, at the same time, under the etch resist.
This creates a cross section of the trace that looks like an hourglass.  The
tip of the hourglass breaks off in long threads.  These copper threads are
solder coated and they have a silver appearance.  This can also be cause by
over-plating copper on the surface of the pattern plated board.

To prove they are not solder or tin whiskers try to melt them with a
soldering iron or reflow them in your oven.  They are an order of magnitude
larger than dendritic growth. I have sent a picture I drew demonstrating the
broken copper edge type defect to Steve's website and have asked him to post
it for your review.

Paul Reid



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