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September 2004

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Subject:
From:
Lee Parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee Parker <[log in to unmask]>
Date:
Fri, 10 Sep 2004 15:31:07 -0400
Content-Type:
text/plain
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text/plain (60 lines)
Carrie

If you cross section the vias, remove the solder from the hole and look
at the copper barrels at very high magnification (use and SEM if
possible)you may see pin holes in the copper or glass bundles protruding
into the hole. This coupled with moisture in the dielectric which is
normal can create the mechanism. When the board is quickly heated in
assembly (reflow or wave solder) the moisture is pressurized and flows
out through the pin holes into the barrels blowing the molten solder in
the barrels out onto the board.

Best regards

Lee

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Morse, Carrie
Sent: Friday, September 10, 2004 2:33 PM
To: [log in to unmask]
Subject: [TN] Blow Holes -- Where the heck does the moisture come from
anyway?

Just wondering a few things here at 2:30 on Friday Afternoon:

1.  What else causes Blow Holes at wave on TH comps?  Is it primarily
moisture?
2.  Where does the moisture come from?
3.  Are certain board materials more likely to sponge up the moisture in
the air?
4.  Can hole wall quality play a part in contributing to blow holes?

-Carrie

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