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Date: | Wed, 22 Sep 2004 12:49:51 -0400 |
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Yes, they do impose special design considerations. A good place to start is
IPC-7095. Which is about to rev to 7095A. There are of course many text
books on the subject. John Lau has written several.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Crain, Peter (GE
Energy)
Sent: Wednesday, September 22, 2004 12:06 PM
To: [log in to unmask]
Subject: [TN] More simple BGA questions
First: Thanks to everyone who gave feedback on my oven question......very
helpful!!
More BGA questions: Do BGAs require any special treatment when designing
PCBs? Can there be top layer traces, vias, and components near the BGA? Is
there a good general spacing around them to allow for inspection / repair?
Can BGAs be mixed with through-hole and sustain the Wave Solder process
(top-side of course) without the use of solder pallets?
Thanks again in advance,
Peter Crain, C.E.T
Manufacturing Engineering
> Network Reliability Services
> General Electric Canada Inc.
> 2728 Hopewell Place N.E., Calgary, Alberta T1Y 7J7 CANADA
> Tel: 403.214.4560, Dialcomm: 8.498.4560 Fax: 403.214.4776
> Email: [log in to unmask]
> Website: www.gepower.com/substationautomation
>
> NOTICE: The information contained in this e-mail is privileged,
> confidential and intended solely for the use of the addressee named above.
> If the reader of this e-mail is not the intended recipient, you are hereby
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>
>
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