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September 2004

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Subject:
From:
"Ingemar Hernefjord (KC/EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ingemar Hernefjord (KC/EMW)
Date:
Mon, 20 Sep 2004 11:54:03 +0200
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Good Morning or Afternoon,

saw movie about the Amtrak incident on Mobile bridge. Terrible. So many unusual failures were involved to cause that accident. The detective work to reconstruct was impressive, they found the sources. Now, need detective work on micro problem, which can also make grey hair. Ordinary aluminium pads, Silicon chip, Autobonded, 25um Au wire, ball, chips silver epoxied, workpiece +150 Centigrades.
One side of chip have normal bonds, other side get oftenly bad bondings with following symptoms: aluminium metallisation bubbles and ball doesn't fasten, the bond pad get what looks like chipouts, but without classic look. Have checked everything: autobonder program, ceramic capillary, chip epoxy bond line, looked after bond pad contaminations, MCM fixture, ball formation, wire quality and a lot more...without finding the reason.  Aluminium looks like it has been boiling, but how on earth could it, the machine just adds U/S power.

Maybe Phil, jk  or other microguru can whet the neurons and propose some idea? Will post two photos to Steve's headache gallery, one with normal chip before bonding, the other after bonding.

In advance thanks giving I am (Yoda)

Ingemar Hernefjord
Ericsson Microwave Systems

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