Mornin' All!
I have a question about solder masking via's in a BGA pattern, and want to
see if I'm thinking correctly about this.
I think it's a bad idea to leave the via's free from solder mask on the
topside of the board beneath the BGA, and tent the bottomside via's. To me, you're
just asking for trouble down the road because you'll trap flux residue and all
kinds of stuff in the via's that won't be able to be cleaned out well. This
is a 676 ball 1.0mm pitch BGA pattern. Am I wrong about this?
Thanks!
-Steve Gregory-
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