Hello,
Is anybody aware of a simulation tool in order to analyse the temperature
seen by a component during a reflow process ?
The aim is to be able to roughly estimate the temperature effect of
relocating the placement.
The process window for lead-free temperature profile is much tighter, and
maybe difficult to manage for complex board.
Many thanks,
Pascal Guihéneuf
Nortel Networks Wireless
-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-------------------------------------------------------------------------------