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September 2004

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Subject:
From:
Pascal Guiheneuf <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 22 Sep 2004 16:01:53 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (27 lines)
Hello,

Is anybody aware of a simulation tool in order to analyse the temperature
seen by a component during a reflow process ?

The aim is to be able to roughly estimate the temperature effect of
relocating the placement.

The process window for lead-free temperature profile is much tighter, and
maybe difficult to manage for complex board.

Many thanks,

Pascal Guihéneuf
Nortel Networks Wireless




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