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Date: | Tue, 21 Sep 2004 11:26:08 -0700 |
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Peter,
We use 2 contract manufacturers to assemble our boards. The CM with 2
cooling zones in his oven seems to experience less assembly type problems
such as uneven BGA ball collapse across large packages......
joe
-----Original Message-----
From: Crain, Peter (GE Energy) [mailto:[log in to unmask]]
Sent: Monday, September 20, 2004 2:07 PM
To: [log in to unmask]
Subject: [TN] New reflow oven needed for BGAs???
Hi all,
We are looking at placing BGAs. We currently use a 5 zone reflow oven that
does a great job of soldering all other components. In fact, we only have a
few profiles which are used on many products.
Is there a need for more zones when going to BGA? Does size BGA size matter?
Thanks in advance,
Peter
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