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September 2004

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Subject:
From:
"Macko, Joe @ IEC" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Macko, Joe @ IEC
Date:
Tue, 21 Sep 2004 11:26:08 -0700
Content-Type:
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text/plain (51 lines)
Peter,

We use 2 contract manufacturers to assemble our boards.  The CM with 2
cooling zones in his oven seems to experience less assembly type problems
such as uneven BGA ball collapse across large packages......


joe
-----Original Message-----
From: Crain, Peter (GE Energy) [mailto:[log in to unmask]]
Sent: Monday, September 20, 2004 2:07 PM
To: [log in to unmask]
Subject: [TN] New reflow oven needed for BGAs???


Hi all,

We are looking at placing BGAs. We currently use a 5 zone reflow oven that
does a great job of soldering all other components. In fact, we only have a
few profiles which are used on many products.

Is there a need for more zones when going to BGA? Does size BGA size matter?

Thanks in advance,

Peter

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