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Date: | Mon, 13 Sep 2004 08:38:40 -0400 |
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ENIG is the less evil for soldered pads. Immersion gold is self-limiting and thin (2-9 uinches) and the less Au in a solder joint the better to prevent fatigue in duty cycle. Electrolytic Au has a controlled deposit but difficult in ranges less than a 20 uninch window and also need to be thicker than 10 uinches due to the nature of the plating initiation on the Ni surface. A range of 20-50 uinches should be achievable by most fab houses with 20-40 also manageable with balanced geometries.
Jeffrey Bush
Director, Quality Assurance and Technical Support
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302-1890
Tel. 802.257.4571.21 Fax. 802.257.0011
[log in to unmask]
http://www.vtcircuits.com
-----Original Message-----
From: "Janoch Jirí, Ing." [mailto:[log in to unmask]]
Sent: Monday, September 13, 2004 8:06 AM
To: [log in to unmask]
Subject: [TN] FW: soldering on gold pads
Dear Techneters,
could you tell me, please, what does IPC 6012 write about gold plated pads which are soldered ? How thick Au ( microinches) on Ni is good for proper solder joint ? What thickness of Au on pads do you recommend ? Are there any materials on this problem available ?
Many thanks
J.Janoch , TSE
Czech Republic
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Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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