As for the contamination source you might want to investigate the stripping
of the tin/lead used for an etch resist on the surface conductors. This would
be done just prior to solder mask application. Right now the board specs have
one cleanliness test required of bare boards and that is immediately prior to
solder mask application for military product. You might want to check with
the board supplier for those results.
Susan Mansilla
Robisan Lab
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