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September 2004

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"Crain, Peter (GE Energy)" <[log in to unmask]>
Date:
Wed, 22 Sep 2004 12:05:55 -0400
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TechNet E-Mail Forum <[log in to unmask]>, "Crain, Peter (GE Energy)" <[log in to unmask]>
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First: Thanks to everyone who gave feedback on my oven question......very
helpful!!

More BGA questions: Do BGAs require any special treatment when designing
PCBs? Can there be top layer traces, vias, and components near the BGA? Is
there a good general spacing around them to allow for inspection / repair?
Can BGAs be mixed with through-hole and sustain the Wave Solder process
(top-side of course) without the use of solder pallets?

Thanks again in advance,

Peter Crain, C.E.T
Manufacturing Engineering

> Network Reliability Services
> General Electric Canada Inc.
> 2728 Hopewell Place N.E., Calgary, Alberta T1Y 7J7  CANADA
> Tel: 403.214.4560, Dialcomm: 8.498.4560 Fax: 403.214.4776
> Email: [log in to unmask]
> Website:  www.gepower.com/substationautomation
>
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