Chris,

My experience with punched out boards has been the edge finish is
generally not so good. They were electrically okay but not pretty. This
was with a four layer board.

Regards,

Ron Scott C.I.D.
Texas Instruments
Tel:  214.480.4715
Cell: 972.816.7978
[log in to unmask]

 
 

-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of
[log in to unmask]
Sent: Tuesday, September 21, 2004 15:31
To: [log in to unmask]
Subject: [DC] punching 4 layer board

Hi All-
I need to know if anyone is getting multi-layer boards with punched
features today. If so, some feedback on the quality. One of our assembly
houses wants to move some high volume boards to a new supplier who has
already tooled up to punch the arrays.

We've used millions and millions of punched CEM1 PCB's and a few million
punched FR4 2 sided. Never had any problems attributed to the punch vs.
routing process.

Need to know if if 4 or 6 layer FR4 is another story or no different
than 2 sided FR4.

I'm not talking about plated through features, just the board outline
(many boards in an array).

I asked this before and got a little feedback; at the time there was no
feedback from anyone doing it. It seems some of these low cost chinese
houses do nothing else. Has anyone else run into this?

Thanks in advance,
-Chris
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