What is the best way to specify laminate glass transition temp
(Tg)?   These are the types of products we deal with, any recommendations
on what Tg's we should call out?  Call them all150C minimum and be done
with it?  And what about lead-free processes with higher reflow temps, do
we need higher Tg's?

1.) Standard through-hole 6 to 10 layer wave solder single pass, assume 2x
rework
2.) Standard SM 8 to 16 layer, 2x SM reflow, 1x wave solder palletized, 2x
rework
3.) Complex SM 12 to 24 layers, 2x SM reflow, 1x wave or selective solder,
2x rework

Thanks in advance for your wisdom.

-- Gregg

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