Hello Gary.


Typically when soldering Ni to Ni the people use a water soluble flux. The
more active the better. Keep in mind however the ability to clean off the
residues. Sometimes these designs are difficult to solder as well as clean
and when using aggressive fluxes it is most important that they be cleaned
off, so that must be considered in the design of the product.

Hope this helps.

Regards,

Leo Lambert
Technical Director
EPTAC Corp.
Longfellow Square, Bldg. II
8025 So. Willow St., Unite 207
Manchester, NH 03103
P. 800-643-7822 ext 15
F. 603-296-2377
[log in to unmask]
www.eptac.com

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of [log in to unmask]
Sent: Wednesday, August 11, 2004 12:00 PM
To: [log in to unmask]
Subject: [TN] Joining Materials


Our Engineering department wants to solder (Ni to Ni or Ni to Sn), does
anyone
have any recommendations as of which flux and solder to use in this
application?  One of the items is a connector and the other item is a frame.

Gary Bremer

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