Hi Rudy,
Slight correction. To say the purpose of plating brighteners is to co-deposit is not accurate. The purpose of plating additives is more to have a specific effect on the deposit, e.g. a physical property like stress, elongation or simply overall grain refinement. Some additives can and do function without co-depositing. Other additive components don't necessarily co-deposit but they can be occluded in the deposit. Yes, some do co-deposit.
Best,
Roger Mouton
-------------- Original message from R Sedlak : --------------
> Dave:
>
> The purpose of plating brighteners is to co-deposit, and muck up (a technical
> term, meaning to "muck-up") the chrystalline deposit, and make it shiney. And
> if you get too many, or you get some brightener breakdown problems, which does
> occur a lot in gold plating, because of the inert anodes, you can get excessive
> organics in your gold. And the type of structures you are seeing are exactly
> what you would expect...
>
> See, contrary to the common wisdom, electroplating does (sometimes) follow the
> rules of chemistry.
>
> Rudy Sedlak
>
> "David D. Hillman" wrote:
> Hi TechNet! Hey, looking for some help (Rudy, Frank, Gerard, plating
> folks). Background: I have a test board which with approximately 80
> uinches of wirebondable hard gold plating that is having gold wirebond
> process problems. An XPS (xray photoelectron spectroscopy) analysis of a
> "good" versus "bad" test board revealed that the "bad" has significant
> organic surface contamination for carbon and oxygen in the form of a
> hydrocarbon (lots of C-C and C-H bonds). Now the question: can/will a
> hydrocarbon species be codeposited into the gold plating thickness? I
> understand the surface process/issues but the codeposit question came up.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
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