Dave,

What you are describing looks more like a case of surface  contamination.

You do say that some of the parts bonded successfully,  this is a  clue that
the deposit is capable of good wire binding.

I agree that detecting organics is more confusing than informative.  Organics
are everywhere.

Is Plasma cleaning the gold surface part of your prep before wire bonding.
This is one sure way to get rid of most organic surface contaminants and is
very  common in the industry.

Best  regards

George Milad
[log in to unmask]
National Accounts Manager  for Technology
Uyemura International Corporation
Technical Center
240  Town LIne Rd
Southington CT 06489
(516) 901 3874 (mobile)
(860)  793-4011 (office)
(860) 793-4020 (fax)

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