Generally: Soldering plain nickel will require a powerful flux which will
require aqueous removal after soldering. The solder you use will be
dependant on the temperature withstand you require in service, max process
temperatures permissible and so on.

Specifically: Best to talk to your solder supplier to zero in to your
specific needs and requirements. Although it might be novel to your company,
it ought to be a familiar situation to them, If not speak to a full product
range one!

Regards 

Mike Fenner 
Indium Corporation 

T: + 44 1908 580 400
M: + 44 7810 526 317 
F: + 44 1908 580 411 
E: [log in to unmask] 
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Pb-free: www.Pb-Free.com 




-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: 11 August 2004 17:00
To: [log in to unmask]
Subject: [TN] Joining Materials


Our Engineering department wants to solder (Ni to Ni or Ni to Sn), does
anyone
have any recommendations as of which flux and solder to use in this
application?  One of the items is a connector and the other item is a frame.

Gary Bremer

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