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August 2004

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Subject:
From:
Aleks Lozinsky <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Aleks Lozinsky <[log in to unmask]>
Date:
Wed, 11 Aug 2004 21:40:54 -0400
Content-Type:
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Hi Dave,
You may wish to try wirebondable soft gold plating. It has higher
purity,different crystal structure, deposit properties. Hard gold much more
loaded with organics and metallic brighteners (Ni or Co) and normally better
suits for high wear resistance.
Aleks Lozinsky
Technic Toronto
----- Original Message -----
From: "R Sedlak" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, August 11, 2004 8:50 PM
Subject: Re: [TN] SOFT Gold Plating/Contaminate Question


Dave:

The purpose of plating brighteners is to co-deposit, and muck up (a
technical term, meaning to "muck-up") the chrystalline deposit, and make it
shiney.  And if you get too many, or you get some brightener breakdown
problems, which does occur a lot in gold plating, because of the inert
anodes, you can get excessive organics in your gold.  And the type of
structures you are seeing are exactly what you would expect...

See, contrary to the common wisdom, electroplating does (sometimes) follow
the rules of chemistry.

Rudy Sedlak

"David D. Hillman" <[log in to unmask]> wrote:
Hi TechNet! Hey, looking for some help (Rudy, Frank, Gerard, plating
folks). Background: I have a test board which with approximately 80
uinches of wirebondable hard gold plating that is having gold wirebond
process problems. An XPS (xray photoelectron spectroscopy) analysis of a
"good" versus "bad" test board revealed that the "bad" has significant
organic surface contamination for carbon and oxygen in the form of a
hydrocarbon (lots of C-C and C-H bonds). Now the question: can/will a
hydrocarbon species be codeposited into the gold plating thickness? I
understand the surface process/issues but the codeposit question came up.

Dave Hillman
Rockwell Collins
[log in to unmask]

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