Hi TechNet! Hey, looking for some help (Rudy, Frank, Gerard, plating
folks). Background:  I have a test board which with approximately 80
uinches of wirebondable hard gold plating that is having gold wirebond
process problems. An XPS (xray photoelectron spectroscopy) analysis of a
"good" versus "bad" test board revealed that the "bad" has significant
organic surface contamination for carbon and oxygen in the form of a
hydrocarbon (lots of C-C and C-H bonds). Now the question: can/will a
hydrocarbon species be codeposited into the gold plating thickness? I
understand the surface process/issues but the codeposit question came up.

Dave Hillman
Rockwell Collins
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