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August 2004

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Subject:
From:
"Paulus, Jim" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paulus, Jim
Date:
Wed, 11 Aug 2004 11:59:05 -0500
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Rich:
Firstly, we haven't suffered much from this disease lately.  Either our
good fortune was due to Bill Clinton pardoning it just before leaving
office, or the laminate materials have gotten significantly better.
Most FR4 materials today have Tg's of 140C or better, which has helped.
Regards the testing, I don't think any IPC-TM was capable of
discriminating or predicting which materials or boards would measle.
The best tests were company-specific, used by Advance Circuits in Mpls
and Texas Instr among several. They involved preparing the laminate
specimen by etching half so it was clad one side/etched opposite side
and then alternate that on the other half.  Then do the solder float and
inspect for the famous white spots.
The key was that the IPC method called for solder floating samples that
are entirely etched or fully clad both sides - the etched sample never
failed and you never saw what was underneath the cladding on the clad
sample.
Jim
PS Was the spotted owl's problem just a viral infection?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Kraszewski
Sent: Wednesday, August 11, 2004 11:41 AM
To: [log in to unmask]
Subject: [TN] IPC Test methods for measeling of laminate

Can any one tell me what the appropriate IPC test methods would be
measeling of FR4 laminate?  I understand there is a float test of some
sort.
 
 
Rich K  / KEDS

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