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August 2004

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Subject:
From:
Richard Kraszewski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Richard Kraszewski <[log in to unmask]>
Date:
Wed, 11 Aug 2004 09:50:05 -0500
Content-Type:
text/plain
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text/plain (62 lines)
IPC SM-785 has some good information on this topic.

Rich Kraszewski 
Advanced Manufacturing Engineer - KEDS
Phone:  260.925.8919
 
 
 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ingemar Hernefjord
(KC/EMW)
Sent: Wednesday, August 11, 2004 9:29 AM
To: [log in to unmask]
Subject: [TN] SMT packages and vibration resistance


Hi,
I have tried to find what a typical AD9696 package can withstand in
terms om vibration, normally mounted on a small FR4 board, so small that
you get no acceleration amplification or other bieffects. 9696 is a
ceramic small outline package with a few terminals, kind of dual line
flatpack. Now, it's not that easy to find anything. All say they perform
whole bunch of tests on their packages, and you can get all out of their
fine plan, everything, but not about the level of vibration
acceleration. They just say they have done vibration. E.g. the below
plan, which is all excellent, but no information about vibration levels,
and type of vibration.

http://www.national.com/ms/PA/PACKAGE_RELIABILITY.pdf

Anyone who knows who knows who knows about vibration tests on SMT
packages? I've seen a hundred articles on the web, but all avoid
mentioning the level of vibration.

Ingemar Hernefjord
Ericsson Microwave Systems

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