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August 2004

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Subject:
From:
Ed Popielarski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ed Popielarski <[log in to unmask]>
Date:
Tue, 10 Aug 2004 20:47:19 -0700
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Cheryl,

Are you trying to remove fused solder or solder paste from the barrels?

If fused, I caution an attempt to remove "all" of the solder, as the
remaining Cu base metal might not be compatible with the press pins. Removal
of excess solder would easily be accomplished with a hot air method. Total
removal of the solder would most likely require drilling to remove the
intermetalic layer (Sn,Pb,Cu alloy) which can be accomplished with a "bomb
site" drill. Time consuming and somewhat risky, but it can be done.

If it's solder paste in the hole, most likely it could be washed out, and
should, since the flux remaining in the interface can cause serious problems
down the road. Wiping the surface can compact the spheres into the hole and
make washing impractical, so an adequate cleaning process must be utilized.

Austin American Technologies makes an outstanding system for cleaning
misprint boards and stencils called the "X-Cleaner". Please feel free to
contact me offline to discuss this further if you like.

Regards,

Ed Popielarski
QTA Machine
27291 Jardines
Mission Viejo, Ca. 92692

Phone:949-581-6601
Fax: 949-218-7829 <------NEW!
WWW.QTA.NET

Be true to your work, your word, and your friends.
Henry David Thoreau

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