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August 2004

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Subject:
From:
Eddie Rocha <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Eddie Rocha <[log in to unmask]>
Date:
Fri, 6 Aug 2004 10:11:08 -0700
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Can somebody help me with this question? Will PCB fabricators need to use a
different type of laminate for the lead free assembly process? I understand
the temperatures will be higher for lead-free solders so will the typical
high temperature FR4's (170-180 Tg) be acceptable?

I ask this because I see a new high temperature FR4 with the same 170-180 Tg
offered by the laminate suppliers. Is there another requirement for the
laminate that is needed for lead-free assembly?

thanks,

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