I have some ideas and a LOT of experience with the Shadow process. If you
would like to contact me off line I can go over them.

Regards,

James Hofer
Director of Operations
Accurate Circuit Engineering
3019 S. Kilson Dr.
Santa Ana Ca. 92707-4202
714-546-2162 work
714-473-6127 cell
[log in to unmask]
----- Original Message -----
From: "Mike Wolf" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, August 31, 2004 11:41 AM
Subject: [TN] Resist adhesion failures


> We are experiencing resist adhesion failures in a random spotty nature,
> after develop traces and or pads will just not be adhered.
>
> We run a cert. piece everyday that never has these problems.
> The cert piece is ED/double treat right out of the box.
>
> The copper that has the adhesion problems has been processed in our
> shop, we run electrochem's shadow system.
>
> I know its not much to go on more details available to anyone
> interested.
>
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>

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